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F75367
F75367 Datasheet
O 1oC Temperature Sensor with I2C-SST Bridge
Release Date: February, 2008 Revision: V0.11P
Feb., 2008 V0.11P
F75367
F75367 Datasheet Revision History
Version V0.10P V0.11P Date 2007/12/20 2008/2/29 Page Revision History Preliminary Version. Add register and function descriptions
Please note that all data and specifications are subject to change without notice. All the trade marks of products and companies mentioned in this data sheet belong to their respective owners.
LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Fintek for any damages resulting from such improper use or sales.
Feb., 2008 V0.11P
F75367
Table of Contents
1. GENERAL DESCRIPTION ......................................................................................................................................................5 2. FEATURES ....................................................................................................................................................................................5 3. KEY SPECIFICATIONS ..............................................................................................................................................................5 4. PIN CONFIGURATION...............................................................................................................................................................6 5. PIN DESCRIPTION......................................................................................................................................................................6 5.1. 5.2. POWER PIN .....................................................................................................................................................................6 MONITORING ITEMS AND FAN SPEED CONTROL .............................................................................................................6
6. FUNCTION DESCRIPTION .......................................................................................................................................................7 6.1 6.2 6.3 6.4 6.5 ACCESS INTERFACE ............................................................................................................................................................7 TEMPERATURE MONITORING..............................................................................................................................................8 BETA COMPENSATION.........................................................................................................................................................9 SST MASTER....................................................................................................................................................................10 PCB LAYOUT GUIDE ........................................................................................................................................................10
7. REGISTER DESCRIPTION ......................................................................................................................................................11 7.1. 7.2. 7.3. 7.4. 7.5. 7.6. 7.7. 7.8. 7.9. 7.10. 7.11. 7.12. 7.13. 7.14. 7.15. 7.16. CONFIGURATION REGISTER INDEX 01H ....................................................................................................................11 CONFIGURATION REGISTER INDEX 0AH....................................................................................................................12 EXTERNAL DEVICE ADDRESS REGISTER INDEX 40H ~ 45H .......................................................................................12 EXTERNAL DEVICE INDEX REGISTER INDEX 48H ~ 4DH............................................................................................12 EXTERNAL DEVICE ENABLE REGISTER INDEX 50H ...................................................................................................12 EXTERNAL DEVICE MONITORING CYCLE SELECT REGISTER 1 INDEX 52H ...............................................................12 EXTERNAL DEVICE MONITORING CYCLE SELECT REGISTER 2 INDEX 53H ...............................................................12 SST DEVICE RESET REGISTER INDEX 55H................................................................................................................12 TEMPERATURE INTERRUPT STATUS REGISTER INDEX 61H (IF DEV_BANK_EN IS 0) .............................................13 TEMPERATURE INTERRUPT STATUS REGISTER INDEX 61H (IF DEV_BANK_EN IS 1) .............................................13 TEMPERATURE REAL TIME STATUS REGISTER INDEX 62H (IF DEV_BANK_EN IS 0) .............................................14 TEMPERATURE REAL TIME STATUS REGISTER INDEX 62H (IF DEV_BANK_EN IS 1) .............................................14 TEMPERATURE REAL TIME STATUS REGISTER INDEX 65H........................................................................................15 TEMPERATURE OFFSET BANK SELECT REGISTER INDEX 67H....................................................................................15 TEMPERATURE OFFSET REGISTER INDEX 68H ..........................................................................................................15 DIODE OPEN STATUS REGISTER INDEX 6FH (IF DEV_BANK_EN IS 0)..............................................................15
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7.17. 7.18. 7.19. DIODE OPEN STATUS REGISTER INDEX 6FH (IF DEV_BANK_EN IS 1)..............................................................15 TEMPERATURE REGISTER -- INDEX 70H ~ 83H ..............................................................................................................16 TEMPERATURE FILTER SELECT REGISTER -- INDEX 8EH ...............................................................................................17
8. ELECTRICAL CHARACTERISTIC........................................................................................................................................18 8.1 ABSOLUTE MAXIMUM RATINGS ............................................................................................................................................18 8.2 DC CHARACTERISTICS ..........................................................................................................................................................18 8.3 AC CHARACTERISTICS ..........................................................................................................................................................20 9. ORDERING INFORMATION ...................................................................................................................................................20 10. PACKAGE DIMENSIONS......................................................................................................................................................21
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1. General Description
The F75367 is a temperature sensor IC with compensation and supports I2C to SST Master Bridge function. This chip provides 2-remote temperature sensor, 1-local temperature sensor and 6-remote temperature input by SST Master. The local temperature sensor can be applied to sense environment temperature without any component. The 2 remote temperature sensors can be performed by CPU thermal diode or transistor 2N3906. The F75367 also can support new generational 45nm CPU temperature sensing by varied of CPU. Besides 3 sets temperature sensors, the F75367 also can read 6 temperature inputs from other devices by SST interfaces. The host can read the extra 6 sets temperature by I2C interface (I2C to SST Master Bridge). Totally the F75367 can support 9 temperature outputs for host fan control by I2C. The F75367 is in the green package of 8-pin SOP and powered by 3.3V.
2. Features
Provide 1 on-chip local and 2 remote temperature sensors Accuracy 1 oC from +60oC to +100oC on remote channel Accuracy 3 oC from +60oC to +100oC on local channel Support 6 temperature inputs from external sensor devices (ex: F75395) Beta-compensation support for new generational CPU. SST Master interfaces for external devices' temperature sensing I2C to SST Master Bridge VCC3V operation and 8 SOP Green Package I2C slave address:
A6 F75367 1 A5 0 A4 0 A3 1 A2 1 A1 1 A0 0
3. Key Specifications
Supply Voltage Operating Supply Current Measured Range Remote Diode Temperature Accuracy 3.0V to 3.6V typ. -40 ~ 127 oC 1oC from +60oC to +100oC
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Local Temperature Accuracy 3oC from +60oC to +100oC
4. Pin Configuration
,
5. Pin Description
ILv/OD8-S1 OOD12 AOUT OD12 OD12-5V INts5V AIN P - Low level bi-directional pin (VIH - Output pin(Analog). - Open-drain output pin with 12 mA sink capability. Open-drain output pin with 12 mA sink capability, 5V tolerance. - TTL level input pin and schmitt trigger, 5V tolerance. - Input pin(Analog). - Power. 0.9V, VIL 0.6V.). Output with 8mA drive and 1mA sink capability.
- can select to OD or OUT by register, with 12 mA source-sink capability.
5.1.
Power Pin
Pin Name VCC GND Type P P Description 3.3V power supply voltage input GND
Pin No. 8 5
5.2. Monitoring Items and Fan Speed Control
Pin No. 1 2 Pin Name Type PWR
SST_M
D1+
ILv/OD8-S1 AOUT AIN
Description Intel SST master hardware monitor interface Positive connection to remote temperature sensor
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3 4 6 7 DD2+ SCLK_S SDATA_S
AGND AOUT AIN
INts5V INts5V/OD12
Negative connection to remote temperature sensor Positive connection to remote temperature sensor Slave serial bus clock Slave serial bus data
6. Function Description
The F75367 is a temperature sensor IC with compensation and supports I2C to SST Master Bridge function. This chip provides 2-remote temperature sensors, 1-local temperature sensor and 6-external remote temperature input (external devices) by SST Master. The local temperature sensor can be applied to sense environment temperature without any component. The 2 remote temperature sensors can be performed by CPU thermal diode or transistor 2N3906. The F75367 supports new generational 45nm CPU temperature sensing by varied of CPU. Besides 3 temperature sensors, the F75367 also can read 6 temperature inputs from other devices by SST interfaces. The host can read the extra 6 sets temperature by I2C interface (I2C to SST Master Bridge). Totally the F75367 can support 9 temperature outputs for host fan control by I2C.
6.1 Access Interface
The F75367 can be connected to a compatible 2-wire serial system management bus as a slave device under the control of the master device, using two device terminals SCL and SDA. The F75367 supports I2C protocol of, "Write Byte", "Read Byte", both with or without Packet Error checking (PEC) which is calculated using CRC-8. For detail information about PEC, please check I2C specification. F75367 also supports Alert Response Address (ARA) protocol. The operation of the protocol is described with details in the following sections.
(a) I2C write to internal address register followed by the data byte
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0 SCL SDA
Start By Master
7
8
0
7
8
1
0
0
1
1
0
0
R/W
Ack by 395
D7
D6
D5
D4
D3
D2
D1
D0
Ack by 395
Frame 1 Serial Bus Address Byte 0
Frame 2 Internal Index Register Byte
7 SCL (Continued) SDA (Continued) D7 D6 D5 D4 D3 D2 D1 D0
8
Stop by Master
Frame 3 Data Byte
Figure 1. Serial Bus Write to Internal Address Register followed by the Data Byte
(b) Serial bus write to internal address register only
0 SCL SDA
Start By Master
7
8
0
7
8
1
0
0
1
1
1
0
R/W
Ack by 395
D7
D6
D5
D4
D3
D2
D1
D0
Ack by 395 Stop by Master
Frame 1 Serial Bus Address Byte 0
Frame 2 Internal Index Register Byte
Figure 2. Serial Bus Write to Internal Address Register Only
(c) Serial bus read from a register with the internal address register prefer to desired location
0 SCL SDA
Start By Master
7
8
0
7
8
1
0
0
1
1
1
0
R/W
Ack by 395
D7
D6
D5
D4
D3
D2
D1
D0
Ack by Master Stop by Master
Frame 1 Serial Bus Address Byte 0
Frame 2 Internal Index Register Byte
Figure 3. Serial Bus Read from Internal Address Register
6.2 Temperature Monitoring
The F75367 monitors local and 2 remote temperature sensors. Both can be measured from 0C to 140.875C. The temperature format is as the following table:
Temperature ( High Byte )
Digital Output
Temperature ( Low Byte )
Digital Output
0C 1C 25C
0000 0000 0000 0001 0001 1001
0C 0.125C 0.250C
000 0 0000 001 0 0000 010 0 0000
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50C 75C 90C 100C 140C 0011 0010 0100 1011 0101 1010 0110 0100 1000 1100 0.375C 0.500C 0.625C 0.750C 0.875C 011 0 0000 100 0 0000 101 0 0000 110 0 0000 111 0 0000
Remote-sensor transistor manufacturers
Manufacturer Panasonic Philips
Model Number 2SB0709 2N3906 PMBT3906
6.3 Beta Compensation
The F75367 is configured to detect the temperature of diodes (e.g. 2N3906) or CPU thermal diodes. The diode can be connected in different way as below Figure.
D+ D-
D+ D-
Substrate PNP transistor i.e. CPU
Discrete PNP transistor i.e. 2N3906
The basic of the temperature sensor follows mathematical formula as below:
VBE
1 + 1 Ic1 KT Ie1 KT 1 = x ln = x ln q Ie2 q 1 + 2 Ic 2 2
The F75367 measures temperature from the thermal diodes by the basic. In traditional case, the F75367 outputs dual currents to a thermal diode. Then the F75367 calculates the absolute temperature by VBE. For discrete transistor (i.e. 2N3906), the beta is normally very high such that the percent change in beta is very small. For example, 15% variation in beta for two forced IE currents and the beta is 50 would contribute about 0.32J error per 100J . For Substrate PNP transistor (i.e. CPU), the beta is very small such that the proportional beta variation will very high, and it will cause large error in temperature
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measurement. For example, 15% variation in beta for two forced IE currents and the beta is 0.5 would contribute about 11.12J error per 100J . In Order to solve the second issue, the F75367 provides a beta compensation solution for accurate temperature sensing. The F75367 can support the beta range over 0.2 for beta compensation. In this new method, the F75367 will provide two IE currents, and feedback two IB currents. The F75367 will auto-adjust IE (IE1 and IE2) current and feedback IB (IB1 and IB2) promptly for getting proper IC proportion (IC1/ IC2), then calculates the accurate temperature. This algorithm of beta compensation is suitable for substrate transistor or new generational CPU (i.e. 45nm CPU) because small beta and high proportional beta variation.
6.4 SST Master
F75367 Support 6 external device inputs for temperature reading by SST and pass to host by I2C. It's really a SST to I2C bridge IC for some specific SST temperature sensors' application. User can ready SST temperature sensor by F75367 bridge function. For instance, user would like to read an external SST temperature sensor by F75367. She could follow below list to read the SST Device Temperature.
If the address/index of SST device is 49h/00h.Before you read the temperature from SST device. You should do below list: 1. 2. 3. write register 49h to register 40h (Define external device0 address) write 00h to register 48h (Define external device0 index) write "1" to register 50h bit 0 (Enable external device0)
4. read register 78h to get the temperature value of SST device
Totally the F75367 can support 6 external device inputs by SST master. About the detail setting of register, please refer the register description.
6.5 PCB Layout Guide
PCB can be electrically noisy environments, and the F75367 is measuring very small voltage from the remote sensor, so care must be taken to minimize noise which is occurred at the sensor inputs. The following guideline should be taken to reduce the measurement error of the temperature sensors: Place the F75367 as close as practical to the remote sensing diode. In noisy environments, such as a computer main-board, the distance can be 4 to 8 inches. (typ). This length can be increased if the worst noise sources are avoided. Noise sources generally include clock generators, CRTs, memory buses and PCI/ISA bus etc. Route the D+ and D- tracks close together, in parallel, with grounded guard tracks on each side. Provide
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a ground plane under the tracks if possible. Do not route D+ & D- lines next to the deflection coil of the CRT. And also don't route the trace across fast digital signals which can easily induce bigger error.
GND 10MILS DXP MINIMUM DXN 10MILS GND 10MILS 10MILS
Use wide tracks to minimize inductance and reduce noise pickup. 10 mil track minimum width and spacing is recommended. Try to minimize the number of copper/solder joints, which can cause thermocouple effects. Where copper/solder joints are used, make sure that they are in both the D+ and D- path and at the same temperature. Thermocouple effects should not be a major problem as 1J means that a copper-solder thermocouple exhibits 3V/J D+ & D- to cause a 1J corresponds to about 200V. It , and takes about 200V of the voltage error at
measurement error. Adding a few thermocouples causes a negligible error.
Place a 0.1F bypass capacitor close to the VCC pin. In very noisy environments, place an external 2200pF input filter capacitors across D+, D- close to the F75367. If the distance to the remote sensor is more than 8 inches, the use of twisted pair cable is recommended. It will work up to around 6 to 12 feet. Because the measurement technique uses switched current sources, excessive cable and/or filter capacitance will affect the measurement accuracy. When using long cables, the filter capacitor may be reduced or removed. Cable resistance can also induce errors. 1 series resistance introduces about 0.5J error.
7. Register Description
7.1. Configuration Register Index 01h Bit 7-1 0 Name T_START R/W Default R/W R/W 0 1 Reserved Set one to enable startup of temperature monitoring operations; a zero puts the part in standby mode. Description
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7.2. Configuration Register Index 0ah Bit 7 6 5 4-2 1-0 Name SST_3V_EN R/W Default R/W R/W R/W R 0 0 1 0 0 Reserved Enable SST master to output 3 volt signal Reserved Reserved Reserved Description
7.3. External Device Address Register Index 40h ~ 45h Bit 7-0 Name DEV_ADDR R/W Default R/W 0 Description Device address of external device0 ~ device5 setting.
7.4. External Device Index Register Index 48h ~ 4dh Bit 7-0 Name DEV_INDEX R/W Default R/W 0 Description Device index of external device0 ~ device5.
7.5. External Device Enable Register Index 50h Bit 7-6 5-0 Name DEV_EN R/W Default R/W R/W 0 0 Reserved External device enable. (Bit mask) Description
7.6. External Device Monitoring Cycle Select Register 1 Index 52h
Bit 7-6 5-4 3-2 1-0 Name CYC_SEL3 CYC_SEL2 CYC_SEL1 CYC_SEL0 R/W Default R/W R/W R/W R/W Description 2'b11 Select device monitoring cycle: 2'b11 2'b11: 8hz 2'b10: 4hz 2'b11 2'b01: 2hz 2'b11 2'b00: 1hz
7.7. External Device Monitoring Cycle Select Register 2 Index 53h
Bit 7-6 5-4 3-2 1-0 Name Reserved Reserved CYC_SEL5 CYC_SEL4 R/W Default R R/W R/W R/W 0 Description Select device monitoring cycle: 2'b11 2'b11: 8hz 2'b11 2'b10: 4hz 2'b01: 2hz 2'b11 2'b00: 1hz
7.8. SST Device Reset Register Index 55h
Bit 7 6 Name RESET_SST_EN R/W Default R/W R/W 0 0 Reserved Set this bit to reset SST device, this bit will be cleared after reset Description
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5 4-2 1 0 RESET_DEV_SEL R/W R/W R/W R/W 0 0 0 0 Reserved Select which SST device to be reset Reserved Reserved
7.9. Temperature Interrupt Status Register Index 61h (If DEV_BANK_EN is 0)
Bit Name R/W Default Description A one indicates at least one of TEMP3~TEMP8 temperature sensor has 7 DEV_T_EXC_STS R 0 exceeded high limit or below the "high limit -hysteresis" limit. Write 1 to clear this bit, write 0 will be ignored. 6-3 R 0 Reserved A one indicates TEMP2 temperature sensor has exceeded high limit or 2 T2_EXC _STS R/W 0 below the "high limit -hysteresis" limit. Write 1 to clear this bit, write 0 will be ignored. A one indicates TEMP1 temperature sensor has exceeded high limit or 1 T1_EXC _STS R/W 0 below the "high limit -hysteresis" limit. Write 1 to clear this bit, write 0 will be ignored. A one indicates temperature sensor (local temperature) has exceeded the 0 LOCAL_EXC _STS R/W 0 high limit or below the "high limit -hysteresis" limit. Write 1 to clear this bit, write 0 will be ignored.
7.10. Temperature Interrupt Status Register Index 61h (If DEV_BANK_EN is 1)
Bit 7-6 Name R/W Default R 0 Reserved A one indicates TEMP8 temperature sensor has exceeded high limit or 5 T8_EXC _STS R/W 0 below the "high limit -hysteresis" limit. Write 1 to clear this bit, write 0 will be ignored. A one indicates TEMP7 temperature sensor has exceeded high limit or 4 T7_EXC _STS R/W 0 below the "high limit -hysteresis" limit. Write 1 to clear this bit, write 0 will be ignored. A one indicates TEMP6 temperature sensor has exceeded high limit or 3 T6_EXC _STS R/W 0 below the "high limit -hysteresis" limit. Write 1 to clear this bit, write 0 will be ignored. A one indicates TEMP5 temperature sensor has exceeded high limit or 2 T5_EXC _STS R/W 0 below the "high limit -hysteresis" limit. Write 1 to clear this bit, write 0 will be ignored. Description
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A one indicates TEMP4 temperature sensor has exceeded high limit or 1 T4_EXC _STS R/W 0 below the "high limit -hysteresis" limit. Write 1 to clear this bit, write 0 will be ignored. A one indicates TEMP3 temperature sensor has exceeded high limit or 0 T3_EXC _STS R/W 0 below the "high limit -hysteresis" limit. Write 1 to clear this bit, write 0 will be ignored.
7.11. Temperature Real Time Status Register Index 62h (If DEV_BANK_EN is 0)
Bit 7 6-3 2 Name DEV_T_EXC T2_EXC R/W Default R R R 0 0 0 Description Set when one of TEMP3~TEMP8 exceeds the high limit. Clear when the TEMP3~TEMP8 is below the "high limit -hysteresis" temperature. Reserved Set when the TEMP2 exceeds the high limit. Clear when the TEMP2 is below the "high limit -hysteresis" temperature. Set when the TEMP1 exceeds the high limit. Clear when the TEMP1 is below the "high limit -hysteresis" temperature. Set when the local temperature exceeds the high limit. Clear when the local temperature is below the "high limit -hysteresis" temperature.
1
T1_EXC
R
0
0
LOCAL_EXC
R
0
7.12. Temperature Real Time Status Register Index 62h (If DEV_BANK_EN is 1)
Bit 7-6 5 Name T8_EXC R/W Default R R 0 0 Reserved Set when the TEMP8 exceeds the high limit. Clear when the TEMP8 is below the "high limit -hysteresis" temperature. Set when the TEMP7 exceeds the high limit. Clear when the TEMP7 is below the "high limit -hysteresis" temperature. Set when the TEMP6 exceeds the high limit. Clear when the TEMP6 is below the "high limit -hysteresis" temperature. Set when the TEMP5 exceeds the high limit. Clear when the TEMP5 is below the "high limit -hysteresis" temperature. Set when the TEMP4 exceeds the high limit. Clear when the TEMP4 is below the "high limit -hysteresis" temperature. Set when the TEMP3 exceeds the high limit. Clear when the TEMP3 is below the "high limit -hysteresis" temperature. Description
4
T7_EXC
R
0
3
T6_EXC
R
0
2
T5_EXC
R
0
1
T4_EXC
R
0
0
T3_EXC
R
0
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7.13. Temperature Real Time Status Register Index 65h
Bit 7-1 0 Name DEV_BANK_EN R/W Default R R/W 0 0 Reserved Set 1 to choose external device bank Description
7.14. Temperature Offset bank select Register Index 67h
Bit 7-2 Name Reserved R/W Default RO 0 -This register is for device F75367 use, not for external device used. 1-0
OFFSET_SEL
Description
R/W
0
0: CR68 is local temperature offset. 1: CR68 is temperature 1 offset. 2: CR68 is temperature 2 offset.
7.15. Temperature Offset Register Index 68h
Bit 7 Name R/W Default RO 0 0 Reserved Temperature offset register. The real temperature value will be added by this offset and then will be put into temperature reading (Index 70h~75h). The offset ranges from -64C to +63C. 6-0 T_OFFSET R/W 7'b011_1111: mean temperature + 63; 7'b000_0001: mean temperature + 1; 7'b000_0000: mean temperature + 0; 7'b111_1111: mean temperature - 1; 7'b100_0000: mean temperature - 64; Description
7.16. DIODE OPEN Status Register Index 6Fh
Bit 7-4 4 3 2 1 0 Name DEV_OPEN T2_DIODE_OPEN T1_DIODE_OPEN T0_DIODE_OPEN
(If DEV_BANK_EN is 0)
Description
R/W Default R R R R R R 0 0 0 0h 0h 0h Reserved
One of the diode of external device0-5 (T3~T8) is open or short Reserved External diode 2 is open or short External diode 1 is open or short Internal diode 0 is open or short
7.17. DIODE OPEN Status Register Index 6Fh
Bit Name R/W Default
(If DEV_BANK_EN is 1)
Description
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7-6 5 4 3 2 1 0
T8_DIODE_OPEN T7_DIODE_OPEN T6_DIODE_OPEN T5_DIODE_OPEN T4_DIODE_OPEN T3_DIODE_OPEN
R R R R R R R
0 0 0 0 0 0 0
Reserved The diode of T8 (External Device5) is open or short The diode of T7 (External Device4) is open or short The diode of T6 (External Device3) is open or short The diode of T5 (External Device2) is open or short The diode of T4 (External Device1) is open or short The diode of T3 (External Device0) is open or short
7.18. Temperature Register Index 70h ~ 83h
Address 70h Attribute RO Default Value -Description Local temperature[10:3] reading. The unit of reading is 1C.At the moment of reading this register. (when open or short this byte will return 0) CR71 bit7-bit5 are the Local temperature reading value[2:0]. The unit of reading is 0.125C. CR71 bit 0 is the sign bit of the Local temperature. (when open or short this byte will return 1, "sign bit set to 1") Temperature 1 reading. The unit of reading is 1C.At the moment of reading this register. CR73 bit7-bit5 are the temperature 1 reading value[2:0]. The unit of reading is 0.125C. CR73 bit 0 is the sign bit of the temperature 1. (when open or short this byte will return 1, "sign bit set to 1") Temperature 2 reading. The unit of reading is 1C.At the moment of reading this register. CR75 bit7-bit5 are the temperature 2 reading value[2:0]. The unit of reading is 0.125C. CR75 bit 0 is the sign bit of the temperature 2. (when open or short this byte will return 1, "sign bit set to 1") T3_read (External Device 0) The unit of reading is 1C.At the moment of reading this register. T4_read (External Device 1) The unit of reading is 1C.At the moment of reading this register. T5_read (External Device 2) The unit of reading is 1C.At the moment of reading this register. T6_read (External Device 3) The unit of reading is 1C.At the moment of reading this register. T7_read (External Device 4) The unit of reading is 1C.At the moment of reading this register. T8_read (External Device 5) The unit of reading is 1C.At the moment of reading this register.
71h
RO
--
72h
RO
--
73h
RO
--
74h
RO
--
75h
RO
--
78h 79h 7Ah 7Bh 7C 7D
RO RO RO RO RO RO
-------
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81h 81h 83h 83h 85h 85h 87h 89h 8Bh R/W R/W R/W R/W R/W R/W R/W R/W R/W 3Ch 55h 55h 55h 55h 55h 55h 55h 55h Local Temperature sensor high limit. The unit is 1C. (If DEV_BANK_EN is 0) T3 high limit. The unit is 1C. (If DEV_BANK_EN is 1) Temperature sensor 1 high limit. The unit is 1C. (If DEV_BANK_EN is 0) T4 high limit. The unit is 1C. (If DEV_BANK_EN is 1) Temperature sensor 2 high limit. The unit is 1C. (When DEV_BANK_EN is 0) T5 high limit. The unit is 1C. (If DEV_BANK_EN is 1) T6 high limit. The unit is 1C. (If DEV_BANK_EN is 1) T7 high limit. The unit is 1C. (If DEV_BANK_EN is 1) T8 high limit. The unit is 1C. (If DEV_BANK_EN is 1)
7.19. Temperature Filter Select Register Index 8Eh
Bit 7-6 Name R/W Default R 0 Reserved The queue time for second filter to quickly update values. 00: 8 times. 5-4 IIR-QUEUR2 R/W 1h 01: 16 times. (default). 10: 24 times. 11: 32 times. The queue time for second filter to quickly update values. 00: 8 times. 3-2 IIR-QUEUR1 R/W 1h 01: 16 times. (default). 10: 24 times. 11: 32 times. The queue time for second filter to quickly update values. 00: 8 times. 1-0 IIR-QUEUR-LOCAL R/W 1h 01: 16 times. (default). 10: 24 times. 11: 32 times. Description
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8. Electrical characteristic
8.1 Absolute Maximum Ratings
PARAMETER Power Supply Voltage Input Voltage Operating Temperature Storage Temperature RATING -0.5 to 5.5 -0.5 to VCC+0.5 0 to 70 -55 to 150 UNIT V V C C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device
8.2 DC Characteristics
(TA = 0 C to 70 C, VCC = 3.3V 10%, VSS = 0V ) Parameter Temperature Error, Remote Diode
o
Conditions 60 C < TD < 100 C, VCC = 3.0V to 3.6V -40 oC

o
MIN
TYP 1 1 1
MAX
Unit
o
C
3 3 3.6
o
Temperature Error, Local Diode Supply Voltage range Average operating supply current Standby supply current Resolution Power on reset threshold Diode source current
0 C < TA < 100 C, VCC = 3.0V to 3.6V 3.0
o
o
C
3.3 800 480 0.125 2.2
V uA uA
o
C
2.4
V uA uA
High Level Low Level
95 10
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(TA = 0 C to 70 C, VCC = 3.3V 10%, VSS = 0V) PARAMETER SYM. MIN. TYP. MAX. UNIT CONDITIONS
IN ts5v /OD12 - TTL level bi-directional pin with sink capability of 12 mA and schmitt-trigger level input with 5V tolerance Input Low Voltage Input High Voltage Output Low Current Input High Leakage Input Low Leakage VIL VIH IOL ILIH ILIL 2.0 10 12 +1 -1 0.8 V V mA A A VCC = 3.3 V VCC = 3.3 V VOL = 0.4V VIN = VCC VIN = 0V
IN ts5v /O12 - TTL level bi-directional pin with source-sink capability of 12 mA and schmitt-trigger level input with 5V tolerance Input Low Threshold Voltage Input High Threshold Voltage Output Low Current Output High Current Input High Leakage Input Low Leakage INts5v VtVt+ IOL IOH ILIH ILIL 0.5 1.6 10 0.8 2.0 12 -12 -10 +1 -1 1.1 2.4 V V mA mA A A VCC = 3.3 V VCC = 3.3 V VOL = 0.4 V VOH = 2.4V VIN = VCC VIN = 0V
TTL level Schmitt-triggered input pin with 5V tolerance VtVt+ ILIH ILIL 0.5 1.6 0.8 2.0 1.1 2.4 +1 -1 V V A A VCC = 3.3V VCC = 3.3V VIN = VCC VIN = 0 V
Input Low Threshold Voltage Input High Threshold Voltage Input High Leakage Input Low Leakage
I lv /OD8-S1 - Low voltage level bidirection pin with 8 mA source capability (Internal pull-down sink 1 mA) Input Low Threshold Voltage Input High Threshold Voltage Input High Leakage VlvtVlvt+ ILIHlv 0.4 1.0 +1 V V A VCC = 3.3V VCC = 3.3V VIN = VCC
I lv /OD8 - Low voltage level bidirection pin with 8 mA source capability Input Low Threshold Voltage Input High Threshold Voltage Input High Leakage Input Low Leakage VlvtVlvt+ ILIHlv ILILlv 0.4 1.0 +1 -1 V V A A VCC = 3.3V VCC = 3.3V VIN = VCC VIN = 0 V
19
Feb..,
2008 V0.11P
F75367
8.3 AC Characteristics
t SCL tR tR
SCL
t HD;SDA
t SU;DAT t SU;STO
SDA IN VALID DATA
t HD;DAT
SDA OUT
Serial Bus Timing Diagram
Serial Bus Timing PARAMETER SCL clock period Start condition hold time Stop condition setup-up time DATA to SCL setup time DATA to SCL hold time SCL and SDA rise time SYMBOL t-SCL tHD;SDA tSU;STO tSU;DAT tHD;DAT tR MIN. 2 300 300 50 5 MAX. 300 UNIT uS nS nS nS nS nS
9. Ordering Information
Part Number F75367S Package Type 8 pin SOP Green Package Production Flow Commercial, 0C to +70C
20
Feb..,
2008 V0.11P
F75367
10. Package Dimensions
8 5
c
E
HE
L
1
D
4
0.25 O
A Y SEATING PLANE b e A1 GAUGE PLANE
Control demensio are in mileters .
SYMBOL A A1 b c E D e HE Y L DIMENSION IN MM MIN. MAX. 1.35 1.75 0.10 0.25 0.51 0.33 0.19 0.25 3.80 4.00 4.80 5.00 1.27 BSC 6.20 5.80 0.10 0.40 1.27 0 10 DIMENSION IN INCH MIN. MAX. 0.053 0.069 0.010 0.004 0.013 0.020 0.008 0.010 0.150 0.157 0.188 0.196 0.050 BSC 0.228 0.016 0 0.244 0.004 0.050 10
Feature Integration Technology Inc.
Headquaters 7F, No 31, Shintai Rd., Jubei City, Hsinchu 302, Taiwan, R.O.C. TEL : 886-3-6562727 FAX : 886-3-6560537 www: http://www.fintek.com.tw
Taipei Office Bldg K4, 7F, No. 700, Chung Cheng Rd., Chungho City, Taipei 235, Taiwan, R.O.C. TEL : 886-2-8227-8027 FAX : 886-2-8227-8037
Please note that all datasheet and specifications are subject to change without notice. All the trade marks of products and companies mentioned in this datasheet belong to their respective owner 21 Feb..,
2008 V0.11P

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